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 ZXTP2025F 50V, SOT23, PNP medium power transistor
Summary
V(BR)CEO > -50V IC(cont) = -5A RCE(sat) = 30m PD = 1.2W Complementary part number: ZXTN2031F typical VCE(sat) < - 60mV @ -1A
Description
Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally suited to applications where space is at a premium.
Features
* * * * * Higher power dissipation SOT23 package High peak current Low saturation voltage High gain 50V forward blocking voltage
Applications
* * * * * MOSFET and IGBT gate driving Motor drive Relay, lamp and solenoid drive High side switches DC-DC converters
Pinout - top view
Ordering information
Device ZXTP2025FTA Reel size (inches) 7 Tape width (mm) 8 Quantity per reel 3,000
Device marking
312
Issue 3 - January 2006
(c) Zetex Semiconductors plc 2006
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ZXTP2025F
Absolute maximum ratings
Parameter Collector-base voltage Collector-emitter voltage Emitter-base voltage Peak pulse current Continuous collector current (c) Base current Power dissipation @ TA=25C (a) Linear derating factor Power dissipation @ TA=25C (b) Linear derating factor Power dissipation @ TA=25C (c) Linear derating factor Operating and storage temperature Symbol VCBO VCEO VEBO ICM IC IB PD PD PD Tj:Tstg Limit -50 -50 -7.0 -10 -5 -1.2 1.0 8.0 1.2 9.6 1.56 12.5 -55 to +150 Unit V V V A A A W mW/C W mW/C W mW/C C
Thermal resistance
Parameter Junction to ambient (a) Junction to ambient (b) Junction to ambient (c) Symbol RJA RJA RJA Value 125 104 80 Unit C/W C/W C/W
NOTES: (a) Mounted on 18mm x 18mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions. (b) Mounted on 30mm x 30mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions. (c) As (b) above measured at t<5secs.
Issue 3 - January 2006
(c) Zetex Semiconductors plc 2006
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ZXTP2025F
Characteristics
Issue 3 - January 2006
(c) Zetex Semiconductors plc 2006
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ZXTP2025F
Electrical characteristics (at Tamb = 25C unless otherwise stated)
Parameter Collector-base breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector-emitter cut-off current Collector-base cut-off current Emitter-base cut-off current Static forward current transfer ratio Symbol V(BR)CBO V(BR)CEO V(BR)EBO ICEV ICBO IEBO HFE 180 200 70 12 Collector-emitter saturation voltage VCE(sat) 380 350 120 30 -11 -40 -150 -150 Base-emitter saturation voltage Base-emitter turn-on voltage Transition frequency Output capacitance Delay time Rise time Storage time Fall time VBE(sat) -0.81 -0.95 VBE(on) fT Cobo t(d) t(r) t(stg) t(f) -0.82 190 42 14 23 240 30
2%.
Min. -50 -50 -7.0
Typ. 100 70 8.5
Max.
Unit V V V
Conditions IC=-100A IC=-10mA (a) IE=-100A VCE=-40V, VBE = 1V VCB=-40V VEB=-6V IC=-10mA, VCE=-2V(a) IC=-500mA, VCE=-2V(a) Ic=-5A, VCE=-2V(a) Ic=-10A, VCE=-2V(a)
-20 -20 -10
nA nA nA
560
-20 -60 -230 -200 -0.88 -1.05 -0.92
mV mV mV mV V V V MHz pF ns ns ns ns
IC=-100mA, IB=-10mA(a) IC=-1A, IB=-100mA(a) IC=-2A, IB=-40mA(a) IC=-5A, IB=-500mA(a) IC=-2A, IB=-40mA(a) IC=-5A, IB=-500mA(a) IC=-5A, VCE=-2V(a) Ic=-500mA, VCE=-10V, f=50MHz VCB=-10V, f=1MHz VCC=-12V, IC=-2.5A, IB1=IB2=-125mA
NOTES: (a) Measured under pulsed conditions. Pulse width=300 S. Duty cycle
Issue 3 - January 2006
(c) Zetex Semiconductors plc 2006
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ZXTP2025F
Typical characteristics
Issue 3 - January 2006
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ZXTP2025F
Packaging details - SOT23
L H N D 3 leads G
M
B
A
C K
F
Dim. A B C D F G
Millimeters Min. 2.67 1.20 0.37 0.085 Max. 3.05 1.40 1.10 0.53 0.15
Inches Min. 0.105 0.047 0.015 0.0034 Max. 0.120 0.055 0.043 0.021 0.0059
Dim. H K L M N -
Millimeters Min. 0.33 0.01 2.10 0.45 Max. 0.51 0.10 2.50 0.64 -
Inches Max. 0.013 0.0004 0.083 0.018 Max. 0.020 0.004 0.0985 0.025 -
0.95 NOM
0.0375 NOM
1.90 NOM
0.075 NOM
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
Europe Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com
Americas Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com
Asia Pacific Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com
Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
For international sales offices visit www.zetex.com/offices Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 3 - January 2006
(c) Zetex Semiconductors plc 2006
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